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Thermal interface gap filler

SDP Series

The SDP Series is a thermal interface material that cures at room temperature by mixing liquid A and B. We have a line-up of products with thermal conductivity 9.5 W/m·K.

Features

Applications

Consistensy

Before curing: Grease fits well on the substrate surface / After curing: Cure in soft sheets 
Can be applied to any shape
Can be applied to any shape

General properties

Parameter Product name SDP-5040-A/B SDP-6560-A/B SDP-8070-A/B SDP-9550-A/B

Thermal conductivity

W/m·K
5.1 6.5 8.0 9.5

Standard curing condition

25°C×24 h

Before curing

Appearance

A: Grayish white
B: Pink
Grease
A: Grayish white
B: Pink
Grease
A: Grayish white
B: Pink
Grease
A: Gray
B: Pale pink
Grease

Viscosity at 25°C

Pa·s
A: 181 / B: 162 A: 282 / B: 288 A: 196 / B: 203 A: 197 / B: 225

Mixed viscosity at 25°C

Pa·s
169 284 201 214

Blend ratio

100 : 100

Specific gravity at 25°C

A: 3.25 / B: 3.26 A/B: 3.20 A/B: 3.14 A/B: 3.05

After curing

Hardness   Shore OO

42 61 69 54

Dielectric breakdown strength

kV/mm
21 20 16 14
(Not specified values)
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