Shin-Etsu Silicone Rubber for Molding Selection Guide

No Post Cure LIMS (Oil Bleeding)

  • Low molecular weight siloxane is significantly reduced and post cure is not required, reducing CO2 emissions.
  • As it is an oil-bleed type, it is ideal for waterproof sealing of wire harnesses, etc.
  • Injection molding allows for automation of molding.

Product Information

Key Points

Use For molding
Molding method Injection molding, addition curing
Features Oil bleeding, reduced low-molecular-weight siloxane, no post cure, low CO2 emissions
Industry General industry, automobiles, transport

Application

  • Waterproof seals for wire harnesses (connector seals, multi-pole plugs).
  • Gaskets, packing, O-rings and other sealing materials.

Expected Results

  • Reduced low-molecular-weight siloxane ⇒ No post cure in a oven.
  • Eliminate post cure process ⇒ Reduce energy costs, CO2 emissions, and mold contamination.
  • Oil bleeding ⇒ Excellent waterproof reliability, good workability.
Parameter＼Product name KE-2017
-20-A/B		 KE-2017
-30-A/B		 KE-2017
-40-A/B		 KE-2017
-50-A/B
Appearance Translucent Translucent Translucent Translucent
Viscosity(A/B)(Pa・s : 0.9s-1) 610/490 1,940/1,590 1,790/1,550 2,030/1,710
Curing speed
at 130℃ (MDR)		 T10 31 44 35 33
T90 86 85 76 72
Test piece
standard curing conditions		 Primary cure 150℃×10m 150℃×10m 150℃×10m 150℃×10m
Post cure Not required Not required Not required Not required
Density at 23℃ (g/cm3) 1.10 1.14 1.14 1.14
Hardness (Durometer A) 24 32 43 50
Elongation at break (%) 840 740 620 480
Tensile strength (MPa) 7.4 8.9 9.0 9.3
Tear strength Angle piece (kN/m) 13 22 34 40
Compression set 150℃×70h (％) 13 18 18 18
Low-molecular-weight siloxane content （ppm：ΣD3～8） 350＞ 350＞ 350＞ 350＞

(Not specified values)

Comparative Data on Low-Molecular-Weight Siloxane Content by Solvent Extraction Method

Comparison of Molding Process Times

・The amount of low-molecular-weight siloxane after just the primary cure is less than that of our general products (after post cure).
・This contributes to improving the reliability of electronic devices and reducing CO2 emissions.
・Since there is no post cure process, the process time can be reduced by approximately 90%.

Product Inquiry

No Post Cure LIMS (Oil Bleeding)

Inquiry Form

Contact by Telephone or Fax

Related Material

Silicone Rubber for Molding（3.0MB）

Characteristic properties of Silicone Rubber Compounds（1.0MB）