Shin-Etsu Silicone Rubber for Molding Selection Guide

No Post Cure LIMS (High Tear Strength)

  • Low molecular weight siloxane is significantly reduced and post cure is not required, reducing CO2 emissions.
  • It has high tear strength and excellent mechanical strength.
  • Suitable for healthcare applications.Compliant with food-related standards.
  • Injection molding allows for automation of molding.

Product Information

Key Points

Use For molding
Molding method Injection molding, addition curing, no post cure
Features High strength, reduced low-molecular-weight siloxane,
low CO2 emittions, FDA, BfR, ISO-10993-1
Industries General industry, healthcare, food, automotive, electrical and electronics

Application

  • Components that require rubber strength, such as when subjected to stress
  • Materials that must meet specific standards, such as healthcare and food-related products
  • Automotive, electrical and electronic products, and other general industrial uses

Expected Results

  • Reduced low-molecular-weight siloxane ⇒ No post cure in a oven.
  • Eliminate post cure process ⇒ Reduce energy costs, CO2 emissions, and mold contamination.
  • Compliant with FDA/ISO-10993-1 and other standards ⇒ Can be used for applications requiring compliance with standards.
Parameter＼Product name KEG-2003H
-30-A/B		 KEG-2003H
-40-A/B		 KEG-2003H
-50-A/B		 KEG-2003H
-60-A/B		 KEG-2003H
-70-A/B
Appearance Translucent Translucent Translucent Translucent Translucent
Viscosity(A/B)(Pa・s : 0.9s-1) 740/690 900/960 1,030/1,000 750/700 1,040/1,010
Curing speed
at 130℃ (MDR)		 T10 23 23 21 22 30
T90 44 45 41 43 61
Test piece
standard curing conditions		 Primary cure 150℃×5m 150℃×5m 150℃×5m 150℃×5m 150℃×5m
Post cure Not required Not required Not required Not required Not required
Density at 23℃ (g/cm3) 1.13 1.13 1.13 1.13 1.14
Hardness (Durometer A) 31 41 51 60 69
Elongation at break (%) 900 830 790 660 490
Tensile strength (MPa) 9.3 9.1 10.6 9.9 9.1
Tear strength Crescent piece (kN/m) 30 36 40 46 46
Low-molecular-weight siloxane content （ppm：ΣD3～8） 350＞ 350＞ 350＞ 350＞ 350＞

(Not specified values)

Comparison of Rubber Strength Between Post Cure Products and KEG-2003H Series

・The KEG-2003H series has excellent rubber strength without post cure (compared to our products which require post cure).

Comparative Data on Low-molecular-weight Siloxane Content by Solvent Extraction Method.

Comparison of Molding Process Times

・The amount of low-molecular-weight siloxane after just the primary cure is less than that of our general products (after post cure).
・This contributes to improving the reliability of electronic devices and reducing CO2 emissions.
・Since there is no post cure process, the process time can be reduced by approximately 90%.

Product Inquiry

No Post Cure LIMS (High Tear Strength)

Inquiry Form

Contact by Telephone or Fax

Related Material

Silicone Rubber for Molding（3.0MB）

Characteristic properties of Silicone Rubber Compounds（1.0MB）