Shin-Etsu Silicone Rubber for Molding Selection Guide

Low Density LIMS

  • Low density allows for lightweight molded products.
  • Can be used without post cure, reducing CO2 emissions.
  • Injection molding allows for automation of molding.

Product Information

Key Points

Use For molding
Molding method Injection molding, addition curing
Features Low density, lightweight, low thermal conductivity
Industries General industry, automotive, transport, electrical and electronics, wearables

Application

  • Materials for transport, smartphones, wearable devices, and other devices that require lightweight construction.
  • Applications and materials that need to float on water, such as recycling processes and toys.

Expected Results

  • Low density⇒Lightweight molded products, improved usability
  • No post cure ⇒ Reduced CO2 emissions
Parameter＼Product name Low density high strength type Low density type
X-34-4347-A/B X-34-4352-A/B
Appearance Reddish brown Reddish brown
Viscosity A/B (Pa・s: 0.95s-1) 249/258 231/286
Curing speed at 130℃
(MDR)		 T10 32 34
T90 63 65
Test piece standard curing conditions
(injection molding)		 Primary cure 140℃×35s 140℃×35s 140℃×30s 140℃×30s
Post cure Not required 150℃×1h Not required 150℃×1h
Density at 23℃ (g/cm3) 0.91 0.93 0.48 0.59
Hardness (Durometer A) 39 41 34 38
Elongation at break (%) 610 570 430 540
Tensile strength (MPa) 5.5 5.7 1.3 1.6
Tear strength Crescent piece (kN/m) 8 8 6 6
Linear shrinkage at 150℃ (%) -2 -3 +6 -2
Compression set 150℃×22h (％) 20 14 – –

(Not specified values)

Injection Molding with Low Density LIMS

Density After Post Cure

・It is 16 to 43% lighter than our standard products.
・With a density of less than 1.00g/cm3, it is possible to create molded products that float on water.

Product Inquiry

Low Density LIMS

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Related Material

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