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- No post cure (Reduced low-molecular-weight siloxone content)
No post cure (Reduced low-molecular-weight siloxone content)
Results 23
KNP-561-U (Developed products)
KNP-561-U (Developed products)
- Reduction in low-molecular-weight siloxane, no need for post cure
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- For extrusion molding
KNP-551-U (Developed products)
KNP-551-U (Developed products)
- Reduction in low-molecular-weight siloxane, no need for post cure
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- For extrusion molding
KNP-541-U (Developed products)
KNP-541-U (Developed products)
- Reduction in low-molecular-weight siloxane, no need for post cure
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- For extrusion molding
KE-2019-50-A/B
KE-2019-50-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Low compression set.
KE-2098-60-A/B
KE-2098-60-A/B
- Can be bonded to polyamide or metal without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic, metal.
KE-2098-50-A/B
KE-2098-50-A/B
- Can be bonded to polyamide or metal without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic, metal.
KE-2098-40-A/B
KE-2098-40-A/B
- Can be bonded to polyamide or metal without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic, metal.
KE-2097-60-A/B
KE-2097-60-A/B
- Can be bonded to polycarbonate without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic.
- Conforms to food standards
KE-2097-50-A/B
KE-2097-50-A/B
- Can be bonded to polycarbonate without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic.
- Conforms to food standards
KE-2097-40-A/B
KE-2097-40-A/B
- Can be bonded to polycarbonate without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic.
- Conforms to food standards
KE-2097-30-A/B
KE-2097-30-A/B
- Can be bonded to polycarbonate without primer
- Adhesive application process and post cure is not required, saving time and reducing costs.
- Applications such as composite molded products of silicone rubber and plastic.
- Conforms to food standards
KE-2019-60-A/B
KE-2019-60-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Low compression set.
KEG-2003H-30-A/B
KEG-2003H-30-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Conforms to FDA, BfR
KE-2019-40-A/B
KE-2019-40-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Low compression set.
KE-2019-30-A/B
KE-2019-30-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Low compression set.
KE-2017-50-A/B
KE-2017-50-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Ideal for waterproof sealing of automotive wiring harnesses.
KE-2017-40-A/B
KE-2017-40-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Ideal for waterproof sealing of automotive wiring harnesses.
KE-2017-30-A/B
KE-2017-30-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Ideal for waterproof sealing of automotive wiring harnesses.
KE-2017-20-A/B
KE-2017-20-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Ideal for waterproof sealing of automotive wiring harnesses.
KEG-2003H-70-A/B
KEG-2003H-70-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Conforms to FDA, BfR
KEG-2003H-60-A/B
KEG-2003H-60-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Conforms to FDA, BfR
KEG-2003H-50-A/B
KEG-2003H-50-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Conforms to FDA, BfR
KEG-2003H-40-A/B
KEG-2003H-40-A/B
- Less likely to cause electrical contact failure. Significantly reduces low-molecular-weight siloxane.
- Since there is no need for a post curing process, it can improve productivity, reduce costs, and save energy (reduce CO2).
- Conforms to FDA, BfR