New Products

High Thermally Conductive Silicone Pad

TC-UP8

TC-UP8 has good compressibility and higher thermal conductivity than our conventional products.

TC-UP8
For heat dissipation of high-heat-generating IC chips

Features

Applications

General properties

Parameter Test Method TC-UP8

Color

- Gray

Structure*

- Single layer

Thickness

mm
- 0.5 to 5.0

Thermal conductivity

W/m·K
Hotdisk (ISO22007-2) 8.0

Hardness

Asker C 15
Shore 00 25

Thermal resistance

cm2·K/W@1.0 mm
50°C/100 psi ASTM D5470 0.28

Breakdown voltage

kV
In air@1 mmt 7

Volume resistivity

Ω·cm
JIS K 6249 1.3 × 1011

Dielectric constant (ε)

50 Hz JIS K 6249 11
100 Hz 12
1 MHz 11

Dielectric dissipation factor (tan δ)

50 Hz JIS K 6249 1.3 × 10‒1
100 Hz 3.6 × 10‒2
1 MHz 1.4 × 10‒2

Low molecular Siloxane content
D3-D10

ppm
Acetone extraction < 30

Flame retardance

UL94 V-0 equivalent

Density at 23℃

g/cm3
JIS K 6249 3.1

Continuous use temp.

°C
- -40 to 180
(Not specified values)

* For improving handling, we can prepare the product;
  -TL which has less tackiness in one side by special treatment

Reliability data (1 mmt)

Long-term reliability

 

Thermal resistance (cm2·K/W) with 30% compression
  Initial 100 h 250 h 500 h 1,000 h

150°C

0.92 0.89 0.92 0.94 0.91

-40°C↔125°C
(1 h/Cycle)

0.92 0.91 0.91 0.89 0.90

85°C/85%

0.92 0.91 0.93 0.94 0.92
(Not specified values)
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