KR-470
Silicone oligomer containing alicyclic epoxy groups
| Required Performance | Low Cure ShrinkageWeather ResistanceHeat Resistance |
|---|---|
| Features and Applications | Alicyclic Epoxy GroupCyclic SiloxaneFor Epoxy Resins |
- Relatively low molecular weight and excellent compatibility with epoxy resin
- Low shrinkage during curing due to cyclic siloxane structure
Product Information
KR-470 is a silicone oligomer that has only epoxy groups as reactive functional groups.
Acid anhydride, photo or thermal cationic curing is possible.
Although it has the same curing mechanism as epoxy resin, it has the heat resistance and high Tg of siloxane.
In addition, the type with cyclic siloxane structure has the advantage of minimal shrinkage during curing.
General Properties
| Item/Product Name | KR-470 | X-40-2678 | X-40-2669 | X-40-2728 |
|---|---|---|---|---|
| Type | Cyclic Siloxane | Cyclic Siloxane | Linear Siloxane | Cyclic siloxane |
| Features | Low cure shrinkage, high cross-linking | Crack resistance | Lower viscosity than KR-470, Excellent leveling and wetting properties |
Crack resistance, low viscosity |
| Organic functional groups | alicyclic epoxy | alicyclic epoxy | alicyclic epoxy | glycidyl |
| Number of epoxy functional groups | 4 | 2 | 2 | 2 |
| Viscosity 25℃(mPa・s) | 3,000 | 120 | 35 | 26 |
| Epoxy equivalent(g/mol) | 200 | 290 | 200 | 280 |
(Not specified values)
Comparison of Curing Properties
| Item/Product Name | KR-470 | Epoxy | Alicyclic epoxy | |
|---|---|---|---|---|
| Curing method | Acid anhydride curing | |||
| Hardness:Shore D | 87 | 85 | 88 | |
| Bending Modulus (MPa) | 2,590 | 2,940 | 3,020 | |
| Cure shrinkage ratio specific gravity method (%) | +2.1 | -1.7 | -5.3 | |
| Water absorption rate by boiling (%) | 0.46 | 0.28 | 0.56 | |
| Tg(℃) | 191 | 150 | 193 | |
| Coefficient of linear expansion (x10-5/K) | <Tg | 9.7 | 7.7 | 6.9 |
| >Tg | 15.4 | 17.6 | 16.2 | |
(Not specified values)
| Applicable solvent type | Organic solvent type |
|---|---|
| Solvent type | Solvent-free |
| Usage | Main component,Additive |
| Curing method | Heat curing,UV curing |
| Hardness of the coating | High |
| Appearance | Colorless transparent liquid |
| Active ingredient (%) | 100 |
| Viscosity at 25℃ | 3000mPa/s |
| Specific gravity at 25℃ | 1.10 |
| Refractive index at 25°C | 1.487 |
| Solvent | - |
| UN Number | N/A |
| Packaging | 1kg,18kg |
(Not specified values)
Product Inquiry
KR-470
Inquiry FormRelated Material
Related Product List
| Product Name | Type | Cure Method | Solvent System | Usage | Film Hardness | Common Name | Brief Description |
|---|---|---|---|---|---|---|---|
| KC-89S | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | Low degree of polymerization methyl oligomer | ・Low molecular weight ・It consists of only T unit. ・It forms high hard film. ・It has been used as binders of coatings. |
| KR-515 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Medium degree of polymerization methyl oligomer | ・Higher molecular weight than KC-89S. ・It consists of only T unit. ・It has been used as binders of coatings and organic resin modifiers. |
| KR-500 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Medium degree of polymerization methyl oligomer | ・Higher molecular weight than KC-89S. ・It consists of only T unit. ・It is a standard product of methyl type. ・It has been used as binders of coatings and organic resin modifiers. |
| X-40-9225 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・Higher molecular weight than KR-500. ・It consists of only T unit. ・It has been used as binders of coatings and organic resin modifiers. |
| X-40-9246 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・D unit is introduced to impart flexibility. ・It has been used as binders of coatings and organic resin modifiers. |
| X-40-9250 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・D unit is introduced to impart flexibility. ・It has been used as binders of coatings and organic resin modifiers. |
| X-88-1004 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High adhesion, high hardness oligomer | ・Excellent adhesion to hard-to-bond substrates such as SUS and acrylic ・High hardness and excellent scratch resistance. |
| X-88-1007 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High adhesion, crack resistant oligomer | ・Excellent adhesion to hard-to-bond substrates such as SUS and acrylic ・Excellent crack resistance and water repellency |
| KR-400N | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness methyl oligomer | ・It forms high hard coatings. ・This products is a KR-400 without the curing catalyst. |
| X-48-1500 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Flex resistant oligomer | ・It combines high hardness and flex resistance. ・Rapid cure |
| X-48-1501 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness, flex resistance, heat crack resistance, impact resistance oligomer | ・It forms a film with high hardness, flex resistance heat resistant crack resistance and impact resistance. |
| X-48-1600 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Ethoxy type, flex resistant oligomer | ・It combines high hardness and flex resistance. ・It cures by deethanol reaction of ethoxy groups. ・Environmentally friendly type (because it is not a demethanol reaction) |
| KR-401N | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Flex resistance, Methyl / Phenyl type oligomer | ・It forms a flexible film. ・High gloss ・This products is a KR-401N without the curing catalyst. |
| KR-510 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Methyl / Phenyl type oligomer for resin modificatioon | ・It is a standard product of methyl / phenyl type. ・It has been mainly used as modification of heat resistance and weatherability of organic resin. ・It imparts flexibility and crack resistance to oligomer type coating agents. |
| KR-213 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Methyl / Phenyl type oligomer for resin modificatioon | ・For resin modification ・It imparts flexibility and crack resistance. |
| X-40-9312 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness, flex resistant oligomer | ・It has high hardness and crack resistance. ・Excellent yellowing resistance and crack resistance after light irradiation |
| KR-400 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | High | One-component cure high hard oligomer | ・It is a standard product of one-component (containing catalyst) type ・It forms high hard film. |
| X-40-2327 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component rapid cure oligomer | ・Rapid cure |
| KR-401 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component cure flex resistant oligomer | ・Excellent flex resistance ・High gloss |
| KR-4000G | Type A | Room Temperature Cure | Organic Solvent | Main Agent | Low | One-component cure high gloss oligomer | ・Excellent gloss ・Excellent water repellency and water sliding property. ・It exhibits antifouling properties even after wiping up applications. |
| X-40-2450 | Type A | Incurable (For Resin Modification) | Solvent-free (100% Silicone Content) | Resin Modifier | – | Ionic liquid modified oligomer | ・Easy to migrate to the surface when added to resin ・It provides antistatic properties with a small amount of addition. ・It has releasability. |
| X-40-9300 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main agent, Resin Modifier | Alkary resistant rapid cure oligomer | ・Rapid curing due to extremely high reactivity of alkoxy groups ・Alkali resistance ・Water resistance |
|
| X-40-9301 | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main agent, Resin Modifier | Alkary resistant oligomer | ・Alkali resistance ・Water resistance |
|
| KR-517 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups and ethoxy groups. ・Epoxy equivalent 830g/mol |
| X-24-9590 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups. ・Epoxy equivalent 590g/mol |
| KR-516 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups. ・Organic functional groups have methyl groups in addition to epoxy groups. ・Epoxy equivalent 280g/mol |
| KR-518 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Mercapto group containing oligomer | ・Alkoxy groups are methoxy groups and ethoxy groups. ・Mercapto equivalent 800g/mol |
| KR-519 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Mercapto group containing oligomer | ・Alkoxy groups are methoxy groups. ・Organic functional groups have methyl groups in addition to mercapto groups. ・Mercapto equivalent 450g/mol |
| KR-513 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Acrylic group containing oligomer | ・Alkoxy groups are methoxy groups. ・Acrylic equivalent 210g/mol |
| X-40-9296 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Methacrylic group containing oligomer | ・Alkoxy groups are methoxy groups. ・Methacrylic equivalent 230g/mol |
| KR-511 | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Vinyl group containing oligomer | ・Alkoxy groups are methoxy groups. ・Vinyl equivalent 530g/mol |
| KR-470 | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | Cyclic siloxane tetrafunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・It has a cyclic siloxane back bone and shrinkage is small during curing. |
| X-40-2678 | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Cyclic siloxane bifunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・It has a cyclic siloxane back bone and shrinkage is small during curing. ・Excellent crack resistance due to bifunctionality |
| X-40-2669 | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Linear siloxane bifunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・With straight-chain siloxane back bone, good leveling property and wettability ・Low viscosity and effective as a reactive diluent |
| X-40-2728 | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Glycidyl group containing cyclic siloxane bifunctional oligomer | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・ It has a cyclic siloxane back bone and shrinkage is small during curing. ・Excellent crack resistance due to bifunctionality |
| X-40-2761 | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Acrylic group containing flex resistant oligomer | ・It imparts crack resistance. ・Excellent compatibility with acrylates and various photo initiators |
| KR-2710 | Type R | Incurable | Solvent-free | Resin Modifier | – | Polycarbonate flame retardant | ・Polycarbonate flame retardant ・Excellent transparency |
| X-48-1800 | – | Incurable | Solvent-free | Resin Modifier | – | Silicone for cold blend resin modification | ・Cold blend resin modifier for silane modified acrylic resin ・Improving weatherability, heat resistance, magic marker stain resistance and acid and alkali resistance ・Recommended addition amount = 10 to 50 parts per 100 resin solid content |
| X-48-1801 | – | Incurable | Solvent-free | Resin Modifier | – | Silicone for cold blend resin modification | ・Cold blend resin modifier for isocyanate curing resin ・Improving weatherability, magic marker stain resistance ・Recommended additive amount = 3% to 20% (converted to NCO equivalent) to curing agent |
| X-48-5030 | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent | High | Solvent-free UV cure hard coating agent | ・Excellent low viscosity, scratch resistance, and low warpage |
| X-48-5031 | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent | High | Solvent-free UV cure hard coating agent | ・Excellent weatherability, low viscosity, scratch resistance and low warpage. |
| X-88-2003A | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | High | High hard, crack resistant, anti-fouling coating agent | ・It has high hardness and crack shrinkage property (Water repellency, water sliding property, magic marker stain resistance) ・One-component rapid cure type |