ES-1001N

Epoxy resin modified silicone resin

Required Performance	Anticorrosion PropertiesChemical ResistanceWater ResistanceElectrical InsulationHeat Resistance
Features and Applications	Heat-resistant PaintOne-componentHeavy Anticorrosion PaintIndustrial Paints

This product has the heat resistance of silicone resin and corrosion resistance and adhesion of epoxy resin.
This is a standard product of epoxy resin modified series.
This product has been used as binder for coating agents.

Product Information

ES-1001N is used as a vehicle for heat-resistant paints, electrical insulating paints, and corrosion-resistant protective paints, and forms a film with excellent heat resistance, weather resistance, adhesion, water resistance, rust resistance, solvent resistance, and chemical resistance.

Instructions for Use

White paint
Formulation: Pigment(TIPAQUE R-820*1)/Binder=0.4 Base Material: Polished steel plate
Curing conditions	150℃/60min	200℃/30min
Film thickness (μm)	20	20
Pencil hardness	3Ｈ	4Ｈ
Adhesion (cross-cut adhesion test)	100/100	100/100
Flrxural resistance 2mmφ	NAD	NAD
Impact resistance DuPont test, 500g, 50cm	NAD	NAD
Ethanol rubbing test (times)	＞100	＞100
Boiling water resistance test 2h	Slightly whitening	NAD
Salt spray 48h later	NAD	NAD
Acid resistance 5% sulfuric acid solution, 1 day	NAD	NAD
Alkali resistance, 5% NaOH solution, 1 day	NAD	NAD
Gloss retention ratio after 250°C/24h (%)	80	40
Color difference after 250℃/24h	40	40

(Not specified values)

∗1: Made by Ishihara Sangyo Kaisya. Ltd.

Resin for electrical insulation, resin for coil impregnation
Curing conditions		100℃/30min
Volume resistivity (Ω・cm)	Normal	＞1.0×10¹⁴
Volume resistivity (Ω・cm)	After flooding	＞1.0×10¹³
Dielectric breakdown strength 0.1mm (kV)	Normal	＞6.5
Dielectric breakdown strength 0.1mm (kV)	After flooding	＞6.0

(Not specified values)

∗: Conform to JIS C2122

Applicable solvent type	Organic solvent type
Applicable resin	Silicone,Epoxy
Solvent type	Organic solvent
Usage	Main component
Curing method	Heat curing
Hardness of the coating	High
Appearance	Pale yellow transparent liquid
Non-volatile content (105°C x 3h) %	45
Viscosity at 25℃	350mPa/s
Specific gravity at 25℃	1.01
Solvent	Xylene,Diacetone alcohol,n-Butanol
Standard curing conditions	200℃×30min
UN Number	UN1866
Packaging	1kg, 18kg, 200kg

(Not specified values)

Product Inquiry

ES-1001N

Inquiry Form

Contact by Telephone or Fax

Related Material

Product Brochure "Silicone Resins & Oligomers" [1.6MB]

Related Product List

Product Name	Type	Cure Method	Solvent System	Usage	Film Hardness	Common Name	Brief Description
KR-220L	Methyl Type	Heat Cure	Solvent-free (Solid)	Main Agent	High	Flake shape methyl resin	・Solid flake form (100% silicone content) ・It has been used in resistor coatings, binders for metal powder sintered compacts, etc.
KR-220LP	Methyl Type	Heat Cure	Solvent-free (Solid)	Main Agent	High	Powder shape methyl resin	・Solid powder form (100% silicone content) ・Grinded KR-220L into powder.
KR-242A	Methyl Type	Heat Cure	Organic Solvent	Main Agent	High	Flame retardant methyl resin	・Forms high hard film ・Little smoking by heating. ・It has been used as binders for inorganic materials (i.e. mica).
KR-251	Methyl Type	Room Temperature Dry, Heat Cure	Organic Solvent	Main Agent	Medium	Room temperature drying ethyl resin	・Ultra high degree of polymerization ・Forms a lacquer film even at room temperature if the solvent evaporates ・Forms a film with even better heat resistance and chemical resistance by heating ・It has mainly used as an electrical insulation and waterproof coating agent.</td
X-40-2406M	Methyl Type	Heat Cure	Organic Solvent	Main Agent	–	Releasability methyl resin	・Excellent heat shock resistance ・Heat resistance with releasability ・It has been used as paints and coatings.
KR-211	Methyl / Phenyl Type	Incurable	Organic Solvent	Resin Modifier	–	Methyl / Phenyl resin for resin modification	・Organic resin modifier ・It can impart heat and weather resistance. ・It has been mainly used as coating agents.
KR-212	Methyl / Phenyl Type	Incurable	Organic Solvent	Resin Modifier	–	Methyl / Phenyl resin for resin modification	・Organic resin modifier ・Excellent compatibility and flexibility than KR-211 ・It can impart heat and weather resistance. ・ It has been mainly used as coating applications.
KR-255	Methyl / Phenyl Type	Room Temperature Dry, Heat Cure	Organic Solvent	Main Agent	Medium	Room temperature drying methyl / phenyl resin	・It forms a lacquer film even at room temperature if the solvent evaporates. ・It forms a film with even better heat resistance and chemical resistance by heating. ・It has been mainly used as electrical insulating water resistant coating agents.
KR-271	Methyl / Phenyl Type	Heat Cure	Organic Solvent	Main Agent	Low	Flexible methyl / phenyl resin	・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings.
KR-272	Methyl / Phenyl Type	Heat Cure	Organic Solvent	Main Agent	Low	Flexible methyl / phenyl resin	・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings. ・It has better drying property than KR-271.
KR-300	Methyl / Phenyl Type	Heat Cure	Organic Solvent	Main Agent	High	High hardness methyl / phenyl resin	・It forms a film with excellent heat resistance. ・High hardness ・It has been mainly used as binders for heat resistant paints.
KR-311	Methyl / Phenyl Type	Heat Cure	Organic Solvent	Main Agent	Medium	Medium hardness methyl / phenyl resin	・Standard product of methyl / phenyl type ・It forms a film with excellent heat resistance. ・Excellent compatibility with organic resins. ・It has been mainly used as binders for heat resistant paints.
X-48-1030	Methyl / Phenyl Type	Heat Cure	TX-free	Main Agent	High	TX-free methyl / phenyl resin	・Development product. ・TX (Toluene, Xylene) solvent free ・DMFDG (dipropylene glycol dimethyl ether) and PGMAC (propylene glycol monomethyl ether acetate) are used as solvents. ・It forms a film by drying under room temperature. ・It forms a high hard film with excellent heat resistance.
X-40-2667A	Methyl / Phenyl Type	Heat Cure	Solvent-free (100% Silicone Content)	Main Agent	Medium	Two-component addition cure methyl / phenyl resin	・Addition cure type ・Two-component product with main agent（liquid A） and curing agent（liquid B）・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate.
X-40-2756	Methyl / Phenyl Type	Heat Cure	Solvent-free (100% Silicone Content)	Main Agent	Medium	One-component addition cure methyl / phenyl resin	・Addition cure type ・One-component product containing catalyst. ・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate.
KR-480	Methyl / Phenyl Type	Incurable	Solvent-free (Solid)	Resin Modifier	–	Thermoplastic methyl / phenyl resin for resin modification	・It is developed as a flame retardant agent for polycarbonate. ・High compatibility with organic resins due to many phenyl groups ・Thermoplastic with almost no silanol groups ・It has been used stress relaxation imparting agent for epoxy moldings.
ES-1001N	Organic Resin Modified Type	Heat Cure	Organic Solvent	Main Agent	High	Epoxy modified resin	・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It is a standard product of epoxy modified series. ・It has been mainly used as a binder for paints (for undercoat).
ES-1002T	Organic Resin Modified Type	Room Temperature Cure	Organic Solvent	Main Agent	High	Epoxy modified resin	・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It can be cured at room temperature by using a polyamine cross-linking agent (KP-390) ・It has been used as a binder for room temperature curable on-site paints (for undercoat).
ES-1023	Organic Resin Modified Type	Heat Cure	Organic Solvent	Main Agent	Medium	Epoxy modified resin	・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has better substrate adhesion and impact resistance than ES-1001N. ・It has been mainly used as a binder for paints (for undercoat).
X-41-1610	Organic Resin Modified Type	Room Temperature Cure, Heat Cure	TX-free	Main Agent	Medium	TX-free epoxy modified resin	・TX(Toluene, Xylene)-free type. PGMAC solvent ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has been mainly used as a binder for paints (for undercoat).
KR-5206	Organic Resin Modified Type	Room Temperature Cure	Organic Solvent	Main Agent	Low	Alkyd modified resin	・It combines the heat resistance of silicone resin with the room temperature curability of alkyd resin. ・It has been used as a binder for room temperature curable on-site paints.
KR-5230	Organic Resin Modified Type	Heat Cure	TX-free	Main Agent	Medium	TX-free polyester modified resin	・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It is a standard product of polyester modified type.
KR-5234	Organic Resin Modified Type	Heat Cure	Organic Solvent	Main Agent	High	Polyester modified resin	・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It has higher curability than KR-5230.
KR-5235	Organic Resin Modified Type	Heat Cure	Organic Solvent	Main Agent	Medium	Polyester modified resin	・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・Due to the non-stick property, it has been used as heat resistant paints around the kitchen.