Shin-Etsu Silicone Selection Guide

KR-220L

Methyl Silicone Resin (Flake Type)

Required Performance Water ResistanceFlame RetardancyElectrical InsulationWeather ResistanceHeat Resistance
Features and Applications One-componentGood Adhesion to Inorganic MaterialsPowder Metallurgy BinderSolid
  • Solid (100% silicone content) in flake form
  • This product has been used as resistor paints, binders for sintered metal powder, etc.
  • Less smoke generation

Product Information

  1. Used as a binder for various inorganic materials, it produces molded products with excellent heat resistance and flame retardance.
  2. This product crosslinkes quickly by heating to form cured materials with excellent solvent resistance and no thermal softening.
  3. It has a large amount of residual scorching heat and exhibits near non-combustibility with very little smoke generation due to heating.
  4. Excellent adhesion to Inorganic materials (i.e. mica).
  5. Since this product is a solid resin, users can choose solvents.
    This product can be diluted with organic solvents (i.e. toluene, xylene and alcohol).
  6. KR-220LP in powder form is also available.

Instruction for use

Mica laminated plates
  1. Make sure it has the proper gelling time before use.
  2. Please mix the following formula ratios and spray the mixture onto the laminated mica to achieve a silicone content of 8-10 %, and mold under the following conditions.
Formulation KR-220L 60 parts, Toluene 440 parts, Isopropyl alcohol 100 parts,
D-220∗1 1.2 parts
Drying (press-curing) 100~105℃/5min
Press curing 180℃/60min×9.8MPa
After Cure 100℃/12h → 150℃/4h →200℃/2h → 250℃/2h → 320℃/2h
∗1
Acid-based catalyst, colorless clear liquid
Appearance Surface smoothness
Bending strength N/mm2 Normal 177
50℃/24h/100%RH 137
Strength of dielectric breakdown kV Normal∗2 23.0
23°C water, 24h immersion∗2 20.4
Volume resistivity Ω・m Normal 4.2×1014
23°C water 24h immersion 5.2×1012

(Not specified values)

∗2
Thickness 0.42mm

Molding compound (binder for inorganic filler)
The compound can be mixed to be 5-30% of the total compound and can be mixed by the following method.

  1. Dry Blend
    Grind KR-220L with a 100 mesh pass and mix with inorganic filler at room temperature. If necessary, add 0.1 to 0.5 wt% of curing catalyst (aluminum-based, titanium-based, zinc-based) to KR-220L to obtain a compound with relatively good storage stability.
  2. Solution Blend
    Mix KR-220L with inorganic filler in an appropriate solvent.
    Dissolve KR-220L in toluene, isopropyl alcohol, methyl ethyl ketone, etc. to a concentration of 30-50%. Then, add 0.1-0.5 wt% of curing catalyst(aluminum-based, titanium-based, zinc-based) to KR-220L if necessary. And then add inorganic filler and mix thoroughly.
    The compound is obtained by removing the solvent by means of decompression drying, spray drying, etc.
  3. Melt Blending
    KR-220L melts and flows at 70 to 150℃, so a compound can be obtained by mixing it with inorganic fillers in a hot mill, etc., and adding a curing catalyst (aluminum-based, titanium-based, zinc-based) in an amount of 0.25wt% or less to KR-220L as needed.

The compound made as described above is in solid or powder form and can be pressure molded at 150-180℃. The molding time depends on the temperature, the presence or absence of catalyst, the type and amount of catalyst, but it requires 5 to 30 minutes. In addition, post-curing at 200°C for 2 to 6 hours improves the properties. For ceramicization, the temperature is increased from 200°C in steps of 20 to 50°C, and then fired at 600 to 1000°C. Note that some fuming is observed at 300-500℃.


Flame-retardant paints
The following mixing ratios can be kneaded in a ball mill to produce flame-retardant coatings that are nearly noncombustible.

Composition KR-220L 15 parts
Silica powder 10 parts
Red iron oxide 5 parts
Talc 40 parts
Clay 30 parts
Methanol 80 parts
Toluene 20 parts
Applicable solvent type Organic solvent type
Applicable resin Silicone
Solvent type Solvent-free
Usage Main component
Curing method Heat curing
Hardness of the coating High
Appearance White solid (flake)
Active ingredient (%) 100
Specific gravity at 25℃ 1.40
Refractive index at 25°C -
Solvent Solvent-free (solid)
UN Number N/A
Packaging 1kg, 10kg

(Not specified values)

Product Inquiry

KR-220L

Inquiry Form

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Related Product List

Product Name  Type Cure Method Solvent System Usage Film Hardness Common Name Brief Description
KR-220L Methyl Type Heat Cure Solvent-free (Solid) Main Agent High Flake shape methyl resin ・Solid flake form (100% silicone content)
・It has been used in resistor coatings, binders for metal powder sintered compacts, etc.
KR-220LP Methyl Type Heat Cure Solvent-free (Solid) Main Agent High Powder shape methyl resin ・Solid powder form (100% silicone content)
・Grinded KR-220L into powder.
KR-242A Methyl Type Heat Cure Organic Solvent Main Agent High Flame retardant methyl resin ・Forms high hard film
・Little smoking by heating.
・It has been used as binders for inorganic materials (i.e. mica).
KR-251 Methyl Type Room Temperature Dry, Heat Cure Organic Solvent Main Agent Medium Room temperature drying ethyl resin ・Ultra high degree of polymerization
・Forms a lacquer film even at room temperature if the solvent evaporates
・Forms a film with even better heat resistance and chemical resistance by heating
・It has mainly used as an electrical insulation and waterproof coating agent.</td
X-40-2406M Methyl Type Heat Cure Organic Solvent Main Agent Releasability methyl resin ・Excellent heat shock resistance
・Heat resistance with releasability
・It has been used as paints and coatings.
KR-211 Methyl / Phenyl Type Incurable Organic Solvent Resin Modifier Methyl / Phenyl resin for resin modification ・Organic resin modifier
・It can impart heat and weather resistance.
・It has been mainly used as coating agents.
KR-212 Methyl / Phenyl Type Incurable Organic Solvent Resin Modifier Methyl / Phenyl resin for resin modification ・Organic resin modifier
・Excellent compatibility and flexibility than KR-211
・It can impart heat and weather resistance.
・ It has been mainly used as coating applications.
KR-255 Methyl / Phenyl Type Room Temperature Dry, Heat Cure Organic Solvent Main Agent Medium Room temperature drying methyl / phenyl resin ・It forms a lacquer film even at room temperature if the solvent evaporates.
・It forms a film with even better heat resistance and chemical resistance by heating.
・It has been mainly used as electrical insulating water resistant coating agents.
KR-271 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Low Flexible methyl / phenyl resin ・It forms a film with excellent heat resistance and electrical insulation.
・Flexibility is a feature, and there is little cracking or peeling at high temperatures.
・It has been mainly used as binders for paints and coatings.
KR-272 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Low Flexible methyl / phenyl resin ・It forms a film with excellent heat resistance and electrical insulation.
・Flexibility is a feature, and there is little cracking or peeling at high temperatures.
・It has been mainly used as binders for paints and coatings.
・It has better drying property than KR-271.
KR-300 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent High High hardness methyl / phenyl resin ・It forms a film with excellent heat resistance.
・High hardness
・It has been mainly used as binders for heat resistant paints.
KR-311 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Medium Medium hardness methyl / phenyl resin ・Standard product of methyl / phenyl type
・It forms a film with excellent heat resistance.
・Excellent compatibility with organic resins.
・It has been mainly used as binders for heat resistant paints.
X-48-1030 Methyl / Phenyl Type Heat Cure TX-free Main Agent High TX-free methyl / phenyl resin ・Development product.
・TX (Toluene, Xylene) solvent free
・DMFDG (dipropylene glycol dimethyl ether) and PGMAC (propylene glycol monomethyl ether acetate) are used as solvents.
・It forms a film by drying under room temperature.
・It forms a high hard film with excellent heat resistance.
X-40-2667A Methyl / Phenyl Type Heat Cure Solvent-free (100% Silicone Content) Main Agent Medium Two-component addition cure methyl / phenyl resin ・Addition cure type
・Two-component product with main agent(liquid A) and curing agent(liquid B)
・Molded products and thick films are possible because there is little cure shrinkage.
・Excellent adhesion with glass substrate.
X-40-2756 Methyl / Phenyl Type Heat Cure Solvent-free (100% Silicone Content) Main Agent Medium One-component addition cure methyl / phenyl resin ・Addition cure type
・One-component product containing catalyst.
・Molded products and thick films are possible because there is little cure shrinkage.
・Excellent adhesion with glass substrate.
KR-480 Methyl / Phenyl Type Incurable Solvent-free (Solid) Resin Modifier Thermoplastic methyl / phenyl resin for resin modification ・It is developed as a flame retardant agent for polycarbonate.
・High compatibility with organic resins due to many phenyl groups
・Thermoplastic with almost no silanol groups
・It has been used stress relaxation imparting agent for epoxy moldings.
ES-1001N Organic Resin Modified Type Heat Cure Organic Solvent Main Agent High Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It is a standard product of epoxy modified series.
・It has been mainly used as a binder for paints (for undercoat).
ES-1002T Organic Resin Modified Type Room Temperature Cure Organic Solvent Main Agent High Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It can be cured at room temperature by using a polyamine cross-linking agent (KP-390)
・It has been used as a binder for room temperature curable on-site paints (for undercoat).
ES-1023 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent Medium Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It has better substrate adhesion and impact resistance than ES-1001N.
・It has been mainly used as a binder for paints (for undercoat).
X-41-1610 Organic Resin Modified Type Room Temperature Cure, Heat Cure TX-free Main Agent Medium TX-free epoxy modified resin ・TX(Toluene, Xylene)-free type. PGMAC solvent
・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It has been mainly used as a binder for paints (for undercoat).
KR-5206 Organic Resin Modified Type Room Temperature Cure Organic Solvent Main Agent Low Alkyd modified resin ・It combines the heat resistance of silicone resin with the room temperature curability of alkyd resin.
・It has been used as a binder for room temperature curable on-site paints.
KR-5230 Organic Resin Modified Type Heat Cure TX-free Main Agent Medium TX-free polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・It is a standard product of polyester modified type.
KR-5234 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent High Polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・It has higher curability than KR-5230.
KR-5235 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent Medium Polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・Due to the non-stick property, it has been used as heat resistant paints around the kitchen.