Shin-Etsu Silicone Selection Guide

ES-1023

Epoxy resin modified silicone resin

Required Performance Heat ResistanceAnticorrosion PropertiesChemical ResistanceWater ResistanceElectrical Insulation
Features and Applications One-componentHeavy Anticorrosion PaintMotorcycle MufflersIndustrial PaintsHeat-resistant Paint
  • This product has the heat resistance of silicone resin and corrosion resistance and adhesion of epoxy resin.
  • This product has better substrate adhesion and impact resistance tan ES-1001N.
  • This product has been used as binder for coating agents.

Product Information

ES-1023 is used as a vehicle for heat-resistant paints, electrical insulating paints, and corrosion-resistant protective paints, and forms films with excellent heat resistance, weather resistance, adhesion, water resistance, thermal shock resistance, solvent resistance, and chemical resistance.
In particular, it has low acid value and suppresses discoloration of aluminum pigments.

Instructions for Use

Silver Coatings
Formulation Pigments/ES-1023=0.9
Base material Polished steel sheet
Curing conditions 180℃/20min
Pencil hardness
Adhesion (cross-cut adhesion test) 100/100
Flexural resistance, 4mmφ NAD
Impact resistance DuPont test 500g 50cm Crack occurred
DuPont test 500g 20cm NAD
Salt spray test after 200h NAD
Acid resistance: 80% sulfuric acid solution, 1 month NAD

(Not specified values)

Application Examples

By using ES-1023, an epoxy-modified silicone resin with excellent anticorrosion and adhesion properties, as an undercoat. And KR-311, a straight silicone resin with excellent heat resistance, as a topcoat, a heat-resistant film with excellent durability can be formed.

Heat Resistant Product Positions

Applicable solvent type Organic solvent type
Applicable resin Silicone, Epoxy
Solvent type Organic solvent
Usage Main component
Curing method Heat curing
Hardness of the coating Medium
Appearance Pale yellow transparent liquid
Non-volatile content (105°C x 3h) % 45
Viscosity at 25℃ 250mPa/s
Specific gravity at 25℃ 1.00
Solvent Xylene, Diacetone alcohol
Standard curing conditions 200℃×30min
UN Number UN1866
Packaging 1kg, 18kg, 180kg

(Not specified values)

Product Inquiry

ES-1023

Inquiry Form

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Related Product List

Product Name  Type Cure Method Solvent System Usage Film Hardness Common Name Brief Description
KR-220L Methyl Type Heat Cure Solvent-free (Solid) Main Agent High Flake shape methyl resin ・Solid flake form (100% silicone content)
・It has been used in resistor coatings, binders for metal powder sintered compacts, etc.
KR-220LP Methyl Type Heat Cure Solvent-free (Solid) Main Agent High Powder shape methyl resin ・Solid powder form (100% silicone content)
・Grinded KR-220L into powder.
KR-242A Methyl Type Heat Cure Organic Solvent Main Agent High Flame retardant methyl resin ・Forms high hard film
・Little smoking by heating.
・It has been used as binders for inorganic materials (i.e. mica).
KR-251 Methyl Type Room Temperature Dry, Heat Cure Organic Solvent Main Agent Medium Room temperature drying ethyl resin ・Ultra high degree of polymerization
・Forms a lacquer film even at room temperature if the solvent evaporates
・Forms a film with even better heat resistance and chemical resistance by heating
・It has mainly used as an electrical insulation and waterproof coating agent.</td
X-40-2406M Methyl Type Heat Cure Organic Solvent Main Agent Releasability methyl resin ・Excellent heat shock resistance
・Heat resistance with releasability
・It has been used as paints and coatings.
KR-211 Methyl / Phenyl Type Incurable Organic Solvent Resin Modifier Methyl / Phenyl resin for resin modification ・Organic resin modifier
・It can impart heat and weather resistance.
・It has been mainly used as coating agents.
KR-212 Methyl / Phenyl Type Incurable Organic Solvent Resin Modifier Methyl / Phenyl resin for resin modification ・Organic resin modifier
・Excellent compatibility and flexibility than KR-211
・It can impart heat and weather resistance.
・ It has been mainly used as coating applications.
KR-255 Methyl / Phenyl Type Room Temperature Dry, Heat Cure Organic Solvent Main Agent Medium Room temperature drying methyl / phenyl resin ・It forms a lacquer film even at room temperature if the solvent evaporates.
・It forms a film with even better heat resistance and chemical resistance by heating.
・It has been mainly used as electrical insulating water resistant coating agents.
KR-271 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Low Flexible methyl / phenyl resin ・It forms a film with excellent heat resistance and electrical insulation.
・Flexibility is a feature, and there is little cracking or peeling at high temperatures.
・It has been mainly used as binders for paints and coatings.
KR-272 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Low Flexible methyl / phenyl resin ・It forms a film with excellent heat resistance and electrical insulation.
・Flexibility is a feature, and there is little cracking or peeling at high temperatures.
・It has been mainly used as binders for paints and coatings.
・It has better drying property than KR-271.
KR-300 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent High High hardness methyl / phenyl resin ・It forms a film with excellent heat resistance.
・High hardness
・It has been mainly used as binders for heat resistant paints.
KR-311 Methyl / Phenyl Type Heat Cure Organic Solvent Main Agent Medium Medium hardness methyl / phenyl resin ・Standard product of methyl / phenyl type
・It forms a film with excellent heat resistance.
・Excellent compatibility with organic resins.
・It has been mainly used as binders for heat resistant paints.
X-48-1030 Methyl / Phenyl Type Heat Cure TX-free Main Agent High TX-free methyl / phenyl resin ・Development product.
・TX (Toluene, Xylene) solvent free
・DMFDG (dipropylene glycol dimethyl ether) and PGMAC (propylene glycol monomethyl ether acetate) are used as solvents.
・It forms a film by drying under room temperature.
・It forms a high hard film with excellent heat resistance.
X-40-2667A Methyl / Phenyl Type Heat Cure Solvent-free (100% Silicone Content) Main Agent Medium Two-component addition cure methyl / phenyl resin ・Addition cure type
・Two-component product with main agent(liquid A) and curing agent(liquid B)
・Molded products and thick films are possible because there is little cure shrinkage.
・Excellent adhesion with glass substrate.
X-40-2756 Methyl / Phenyl Type Heat Cure Solvent-free (100% Silicone Content) Main Agent Medium One-component addition cure methyl / phenyl resin ・Addition cure type
・One-component product containing catalyst.
・Molded products and thick films are possible because there is little cure shrinkage.
・Excellent adhesion with glass substrate.
KR-480 Methyl / Phenyl Type Incurable Solvent-free (Solid) Resin Modifier Thermoplastic methyl / phenyl resin for resin modification ・It is developed as a flame retardant agent for polycarbonate.
・High compatibility with organic resins due to many phenyl groups
・Thermoplastic with almost no silanol groups
・It has been used stress relaxation imparting agent for epoxy moldings.
ES-1001N Organic Resin Modified Type Heat Cure Organic Solvent Main Agent High Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It is a standard product of epoxy modified series.
・It has been mainly used as a binder for paints (for undercoat).
ES-1002T Organic Resin Modified Type Room Temperature Cure Organic Solvent Main Agent High Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It can be cured at room temperature by using a polyamine cross-linking agent (KP-390)
・It has been used as a binder for room temperature curable on-site paints (for undercoat).
ES-1023 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent Medium Epoxy modified resin ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It has better substrate adhesion and impact resistance than ES-1001N.
・It has been mainly used as a binder for paints (for undercoat).
X-41-1610 Organic Resin Modified Type Room Temperature Cure, Heat Cure TX-free Main Agent Medium TX-free epoxy modified resin ・TX(Toluene, Xylene)-free type. PGMAC solvent
・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin.
・It has been mainly used as a binder for paints (for undercoat).
KR-5206 Organic Resin Modified Type Room Temperature Cure Organic Solvent Main Agent Low Alkyd modified resin ・It combines the heat resistance of silicone resin with the room temperature curability of alkyd resin.
・It has been used as a binder for room temperature curable on-site paints.
KR-5230 Organic Resin Modified Type Heat Cure TX-free Main Agent Medium TX-free polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・It is a standard product of polyester modified type.
KR-5234 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent High Polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・It has higher curability than KR-5230.
KR-5235 Organic Resin Modified Type Heat Cure Organic Solvent Main Agent Medium Polyester modified resin ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin.
・Due to the non-stick property, it has been used as heat resistant paints around the kitchen.