X-40-2756
One-component Addition Cure Type Methyl / Phenyl Silicone Resin
| Required Performance | Water ResistanceFlame RetardancyElectrical InsulationWeather ResistanceHeat Resistance |
|---|---|
| Features and Applications | Large Coil Impregnation for RailroadOne-componentThick Film PossibilityElectrical Insulation Applications |
- Addition cure type
- One-component product containing curing catalyst
- Low curing shrinkage enables molded products and thick films
- Good adhesion to glass substrates
Product Information
X-40-2756 is an addition cure type silicone resin. It is 100% silicone and has excellent heat resistance and low water absorption.
It has a higher Tg than conventional products, and because it is a one-component curing type, it has excellent usability.
Comparison Chart of Cured Properties
Molded Product Properties
(Not specified values)
Molding Examples
| Applicable solvent type | Organic solvent type |
|---|---|
| Applicable resin | Silicone |
| Solvent type | Solvent-free |
| Usage | Main component |
| Curing method | Heat curing |
| Hardness of the coating | Medium |
| Appearance | Pale yellow transparent liquid |
| Active ingredient (%) | 100 |
| Viscosity at 25℃ | 1,000 mPa・s |
| Specific gravity at 25℃ | 1.13 |
| Refractive index at 25°C | 1.498 |
| Solvent | - |
| Standard curing conditions | 200℃×60min(dry),200℃×180min(curing) |
| UN Number | N/A |
| Packaging | 1kg,18kg |
(Not specified values)
Product Inquiry
X-40-2756
Inquiry FormRelated Material
Related Product List
| Product Name | Type | Cure Method | Solvent System | Usage | Film Hardness | Common Name | Brief Description |
|---|---|---|---|---|---|---|---|
| KR-220L | Methyl Type | Heat Cure | Solvent-free (Solid) | Main Agent | High | Flake shape methyl resin | ・Solid flake form (100% silicone content) ・It has been used in resistor coatings, binders for metal powder sintered compacts, etc. |
| KR-220LP | Methyl Type | Heat Cure | Solvent-free (Solid) | Main Agent | High | Powder shape methyl resin | ・Solid powder form (100% silicone content) ・Grinded KR-220L into powder. |
| KR-242A | Methyl Type | Heat Cure | Organic Solvent | Main Agent | High | Flame retardant methyl resin | ・Forms high hard film ・Little smoking by heating. ・It has been used as binders for inorganic materials (i.e. mica). |
| KR-251 | Methyl Type | Room Temperature Dry, Heat Cure | Organic Solvent | Main Agent | Medium | Room temperature drying ethyl resin | ・Ultra high degree of polymerization ・Forms a lacquer film even at room temperature if the solvent evaporates ・Forms a film with even better heat resistance and chemical resistance by heating ・It has mainly used as an electrical insulation and waterproof coating agent.</td |
| X-40-2406M | Methyl Type | Heat Cure | Organic Solvent | Main Agent | – | Releasability methyl resin | ・Excellent heat shock resistance ・Heat resistance with releasability ・It has been used as paints and coatings. |
| KR-211 | Methyl / Phenyl Type | Incurable | Organic Solvent | Resin Modifier | – | Methyl / Phenyl resin for resin modification | ・Organic resin modifier ・It can impart heat and weather resistance. ・It has been mainly used as coating agents. |
| KR-212 | Methyl / Phenyl Type | Incurable | Organic Solvent | Resin Modifier | – | Methyl / Phenyl resin for resin modification | ・Organic resin modifier ・Excellent compatibility and flexibility than KR-211 ・It can impart heat and weather resistance. ・ It has been mainly used as coating applications. |
| KR-255 | Methyl / Phenyl Type | Room Temperature Dry, Heat Cure | Organic Solvent | Main Agent | Medium | Room temperature drying methyl / phenyl resin | ・It forms a lacquer film even at room temperature if the solvent evaporates. ・It forms a film with even better heat resistance and chemical resistance by heating. ・It has been mainly used as electrical insulating water resistant coating agents. |
| KR-271 | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Low | Flexible methyl / phenyl resin | ・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings. |
| KR-272 | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Low | Flexible methyl / phenyl resin | ・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings. ・It has better drying property than KR-271. |
| KR-300 | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | High | High hardness methyl / phenyl resin | ・It forms a film with excellent heat resistance. ・High hardness ・It has been mainly used as binders for heat resistant paints. |
| KR-311 | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Medium | Medium hardness methyl / phenyl resin | ・Standard product of methyl / phenyl type ・It forms a film with excellent heat resistance. ・Excellent compatibility with organic resins. ・It has been mainly used as binders for heat resistant paints. |
| X-48-1030 | Methyl / Phenyl Type | Heat Cure | TX-free | Main Agent | High | TX-free methyl / phenyl resin | ・Development product. ・TX (Toluene, Xylene) solvent free ・DMFDG (dipropylene glycol dimethyl ether) and PGMAC (propylene glycol monomethyl ether acetate) are used as solvents. ・It forms a film by drying under room temperature. ・It forms a high hard film with excellent heat resistance. |
| X-40-2667A | Methyl / Phenyl Type | Heat Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | Two-component addition cure methyl / phenyl resin | ・Addition cure type ・Two-component product with main agent（liquid A） and curing agent（liquid B） ・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate. |
| X-40-2756 | Methyl / Phenyl Type | Heat Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component addition cure methyl / phenyl resin | ・Addition cure type ・One-component product containing catalyst. ・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate. |
| KR-480 | Methyl / Phenyl Type | Incurable | Solvent-free (Solid) | Resin Modifier | – | Thermoplastic methyl / phenyl resin for resin modification | ・It is developed as a flame retardant agent for polycarbonate. ・High compatibility with organic resins due to many phenyl groups ・Thermoplastic with almost no silanol groups ・It has been used stress relaxation imparting agent for epoxy moldings. |
| ES-1001N | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | High | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It is a standard product of epoxy modified series. ・It has been mainly used as a binder for paints (for undercoat). |
| ES-1002T | Organic Resin Modified Type | Room Temperature Cure | Organic Solvent | Main Agent | High | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It can be cured at room temperature by using a polyamine cross-linking agent (KP-390) ・It has been used as a binder for room temperature curable on-site paints (for undercoat). |
| ES-1023 | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | Medium | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has better substrate adhesion and impact resistance than ES-1001N. ・It has been mainly used as a binder for paints (for undercoat). |
| X-41-1610 | Organic Resin Modified Type | Room Temperature Cure, Heat Cure | TX-free | Main Agent | Medium | TX-free epoxy modified resin | ・TX(Toluene, Xylene)-free type. PGMAC solvent ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has been mainly used as a binder for paints (for undercoat). |
| KR-5206 | Organic Resin Modified Type | Room Temperature Cure | Organic Solvent | Main Agent | Low | Alkyd modified resin | ・It combines the heat resistance of silicone resin with the room temperature curability of alkyd resin. ・It has been used as a binder for room temperature curable on-site paints. |
| KR-5230 | Organic Resin Modified Type | Heat Cure | TX-free | Main Agent | Medium | TX-free polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It is a standard product of polyester modified type. |
| KR-5234 | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | High | Polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It has higher curability than KR-5230. |
| KR-5235 | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | Medium | Polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・Due to the non-stick property, it has been used as heat resistant paints around the kitchen. |