X-48-5030
Solvent-free UV Curable Hard Coating
Required Performance | Scratch ResistanceLow Warp Properties |
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Features and Applications | Developmental GoodsLow ViscosityUV Curing TypeSolvent-freeAtmospheric Curing |

- UV curable, good curability under air
- Low viscosity, excellent scratch resistance and low warpage
- Compatible with coating methods that require low viscosity, such as spray coating

Product Information
X-48-5030 is a solvent-free UV-curable hard coating agent.
It is coated with a film thickness of approximately 10 μm and irradiated with UV light of 2,000-3,000 mJ/cm2 under atmospheric conditions to form a film with excellent scratch resistance and low warpage.
It shows high adhesion to organic resins and is applicable as a hard coating agent for organic resin components such as PMMA, PC, and PET.
Applicable solvent type | Organic solvent type |
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Solvent type | Solvent-free |
Usage | Main component |
Curing method | UV curing |
Hardness of the coating | High |
Appearance | Pale yellow to yellow transparent liquid |
Non-volatile content (105°C x 3h) % | - |
Active ingredient (%) | 100 |
Viscosity at 25℃ | 40 mPa・s |
Specific gravity at 25℃ | 1.19 |
Refractive index at 25°C | 1.465 |
Standard curing conditions | UV irradiation (under air, 2,000-3,000 mJ/cm2) |
UN Number | UN3082 |
Packaging | 100g, 1kg, 18kg |
(Not specified values)
Low Warp
The state of the film was compared when the following coatings were applied to PET film at a film thickness of approximately 15 μm and UV cured. It can be seen that X-48-5030, which excels in low warpage, significantly suppresses film warpage compared to the comparative coatings, which are general UV-curable acrylic compositions. Coating conditions: Each sample coated on polycarbonate substrate with Bar Coater No. 8 → UV curing (under air, 2,400 mJ/cm2) Comparison paint = DPHA/HDDA/photoinitiator = 85/15/5 (weight ratio), photoinitiator = Omnirad-1173 (IGM Resins)Comparison of Warpage of Coated Film (PET)

Scratch Resistance, Low Viscosity, Film Hardness
Coating conditions: Each sample coated on polycarbonate substrate with Bar Coater No. 8 → UV curing (under air, 2,400 mJ/cm2) Film thickness: Approx. 15 μmCoating film properties*1 | X-48-5030 | X-48-5031 | Comparative paints (DPHA/HDDA/Photoinitiator*4=85/15/5) |
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Paint Viscosity(mPa・s) | 40 | 60 | 520 |
Pencil hardness(750g) | 2H | 2H | 2H |
Steel wool resistant*2 | Good | Good | Good |
Taber test (500g x 500 rpm) | ⊿Hz=5.0 | ⊿Hz=6.8 | ⊿Hz=12.3 |
Adhesion (base material: polycarbonate)*3 | Good | Good | Poor |
Low warp | Good | Good | Poor |
(Not specified values)
*1 Coating conditions: Each sample is coated on a polycarbonate substrate with Bar Coater No. 8 → UV curing (under air, 2,400 mJ/cm2)
*2 No scratches in abrasion resistance test (200g load, 10 times of friction reciprocation) with steel wool (#0000) Good; scratches: Poor
*3 Adhesion: Good = when there is no peeling at all in the cross cut adhesion test (25 squares), Poor = when there is peeling.
*4 DPHA: Dipentaerythritol Hexaacrylate, HDDA: hexanediol diacrylate,
Photoinitiator: Omnirad-1173 (manufactured by IGM Resins)
Product Inquiry
X-48-5030
Inquiry FormRelated Material
Related Product List
Product Name | Type | Cure Method | Solvent System | Usage | Film Hardness | Common Name | Brief Description | |
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KR-220L | Silicone Resin | Methyl Type | Heat Cure | Solvent-free (Solid) | Main Agent | High | Flake shape methyl resin | ・Solid flake form (100% silicone content) ・It has been used in resistor coatings, binders for metal powder sintered compacts, etc. |
KR-220LP | Silicone Resin | Methyl Type | Heat Cure | Solvent-free (Solid) | Main Agent | High | Powder shape methyl resin | ・Solid powder form (100% silicone content) ・Grinded KR-220L into powder. |
KR-242A | Silicone Resin | Methyl Type | Heat Cure | Organic Solvent | Main Agent | High | Flame retardant methyl resin | ・Forms high hard film ・Little smoking by heating. ・It has been used as binders for inorganic materials (i.e. mica). |
KR-251 | Silicone Resin | Methyl Type | Room Temperature Dry, Heat Cure | Organic Solvent | Main Agent | Medium | Room temperature drying ethyl resin | ・Ultra high degree of polymerization ・Forms a lacquer film even at room temperature if the solvent evaporates ・Forms a film with even better heat resistance and chemical resistance by heating ・It has mainly used as an electrical insulation and waterproof coating agent. |
X-40-2406M | Silicone Resin | Methyl Type | Heat Cure | Organic Solvent | Main Agent | – | Releasability methyl resin | ・Excellent heat shock resistance ・Heat resistance with releasability ・It has been used as paints and coatings. |
KR-211 | Silicone Resin | Methyl / Phenyl Type | Incurable | Organic Solvent | Resin Modifier | – | Methyl / Phenyl resin for resin modification | ・Organic resin modifier ・It can impart heat and weather resistance. ・It has been mainly used as coating agents. |
KR-212 | Silicone Resin | Methyl / Phenyl Type | Incurable | Organic Solvent | Resin Modifier | – | Methyl / Phenyl resin for resin modification | ・Organic resin modifier ・Excellent compatibility and flexibility than KR-211 ・It can impart heat and weather resistance. ・ It has been mainly used as coating applications. |
KR-255 | Silicone Resin | Methyl / Phenyl Type | Room Temperature Dry, Heat Cure | Organic Solvent | Main Agent | Medium | Room temperature drying methyl / phenyl resin | ・It forms a lacquer film even at room temperature if the solvent evaporates. ・It forms a film with even better heat resistance and chemical resistance by heating. ・It has been mainly used as electrical insulating water resistant coating agents. |
KR-271 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Low | Flexible methyl / phenyl resin | ・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings. |
KR-272 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Low | Flexible methyl / phenyl resin | ・It forms a film with excellent heat resistance and electrical insulation. ・Flexibility is a feature, and there is little cracking or peeling at high temperatures. ・It has been mainly used as binders for paints and coatings. ・It has better drying property than KR-271. |
KR-300 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | High | High hardness methyl / phenyl resin | ・It forms a film with excellent heat resistance. ・High hardness ・It has been mainly used as binders for heat resistant paints. |
KR-311 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Organic Solvent | Main Agent | Medium | Medium hardness methyl / phenyl resin | ・Standard product of methyl / phenyl type ・It forms a film with excellent heat resistance. ・Excellent compatibility with organic resins. ・It has been mainly used as binders for heat resistant paints. |
X-48-1030 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | TX-free | Main Agent | High | TX-free methyl / phenyl resin | ・Development product. ・TX (Toluene, Xylene) solvent free ・DMFDG (dipropylene glycol dimethyl ether) and PGMAC (propylene glycol monomethyl ether acetate) are used as solvents. ・It forms a film by drying under room temperature. ・It forms a high hard film with excellent heat resistance. |
X-40-2667A | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | Two-component addition cure methyl / phenyl resin | ・Addition cure type ・Two-component product with main agent(liquid A) and curing agent(liquid B) ・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate. |
X-40-2756 | Silicone Resin | Methyl / Phenyl Type | Heat Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component addition cure methyl / phenyl resin | ・Addition cure type ・One-component product containing catalyst. ・Molded products and thick films are possible because there is little cure shrinkage. ・Excellent adhesion with glass substrate. |
KR-480 | Silicone Resin | Methyl / Phenyl Type | Incurable | Solvent-free (Solid) | Resin Modifier | – | Thermoplastic methyl / phenyl resin for resin modification | ・It is developed as a flame retardant agent for polycarbonate. ・High compatibility with organic resins due to many phenyl groups ・Thermoplastic with almost no silanol groups ・It has been used stress relaxation imparting agent for epoxy moldings. |
ES-1001N | Silicone Resin | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | High | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It is a standard product of epoxy modified series. ・It has been mainly used as a binder for paints (for undercoat). |
ES-1002T | Silicone Resin | Organic Resin Modified Type | Room Temperature Cure | Organic Solvent | Main Agent | High | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It can be cured at room temperature by using a polyamine cross-linking agent (KP-390) ・It has been used as a binder for room temperature curable on-site paints (for undercoat). |
ES-1023 | Silicone Resin | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | Medium | Epoxy modified resin | ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has better substrate adhesion and impact resistance than ES-1001N. ・It has been mainly used as a binder for paints (for undercoat). |
X-41-1610 | Silicone Resin | Organic Resin Modified Type | Room Temperature Cure, Heat Cure | TX-free | Main Agent | Medium | TX-free epoxy modified resin | ・TX(Toluene, Xylene)-free type. PGMAC solvent ・It combines the heat resistance of silicone resin with the corrosion resistance and adhesion of epoxy resin. ・It has been mainly used as a binder for paints (for undercoat). |
KR-5206 | Silicone Resin | Organic Resin Modified Type | Room Temperature Cure | Organic Solvent | Main Agent | Low | Alkyd modified resin | ・It combines the heat resistance of silicone resin with the room temperature curability of alkyd resin. ・It has been used as a binder for room temperature curable on-site paints. |
KR-5230 | Silicone Resin | Organic Resin Modified Type | Heat Cure | TX-free | Main Agent | Medium | TX-free polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It is a standard product of polyester modified type. |
KR-5234 | Silicone Resin | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | High | Polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・It has higher curability than KR-5230. |
KR-5235 | Silicone Resin | Organic Resin Modified Type | Heat Cure | Organic Solvent | Main Agent | Medium | Polyester modified resin | ・It combines the heat resistance of silicone resin with the chemical resistance, bending resistance, and high gloss of polyester resin. ・Due to the non-stick property, it has been used as heat resistant paints around the kitchen. |
KC-89S | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | Low degree of polymerization methyl oligomer | ・Low molecular weight ・It consists of only T unit. ・It forms high hard film. ・It has been used as binders of coatings. |
KR-515 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Medium degree of polymerization methyl oligomer | ・Higher molecular weight than KC-89S. ・It consists of only T unit. ・It has been used as binders of coatings and organic resin modifiers. |
KR-500 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Medium degree of polymerization methyl oligomer | ・Higher molecular weight than KC-89S. ・It consists of only T unit. ・It is a standard product of methyl type. ・It has been used as binders of coatings and organic resin modifiers. |
X-40-9225 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・Higher molecular weight than KR-500. ・It consists of only T unit. ・It has been used as binders of coatings and organic resin modifiers. |
X-40-9246 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・D unit is introduced to impart flexibility. ・It has been used as binders of coatings and organic resin modifiers. |
X-40-9250 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High degree of polymerization methyl oligomer | ・D unit is introduced to impart flexibility. ・It has been used as binders of coatings and organic resin modifiers. |
X-88-1004 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High adhesion, high hardness oligomer | ・Excellent adhesion to hard-to-bond substrates such as SUS and acrylic ・High hardness and excellent scratch resistance. |
X-88-1007 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Low | High adhesion, crack resistant oligomer | ・Excellent adhesion to hard-to-bond substrates such as SUS and acrylic ・Excellent crack resistance and water repellency |
KR-400N | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness methyl oligomer | ・It forms high hard coatings. ・This products is a KR-400 without the curing catalyst. |
X-48-1500 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Flex resistant oligomer | ・It combines high hardness and flex resistance. ・Rapid cure |
X-48-1501 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness, flex resistance, heat crack resistance, impact resistance oligomer | ・It forms a film with high hardness, flex resistance heat resistant crack resistance and impact resistance. |
X-48-1600 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Ethoxy type, flex resistant oligomer | ・It combines high hardness and flex resistance. ・It cures by deethanol reaction of ethoxy groups. ・Environmentally friendly type (because it is not a demethanol reaction) |
KR-401N | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Flex resistance, Methyl / Phenyl type oligomer | ・It forms a flexible film. ・High gloss ・This products is a KR-401N without the curing catalyst. |
KR-510 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Methyl / Phenyl type oligomer for resin modificatioon | ・It is a standard product of methyl / phenyl type. ・It has been mainly used as modification of heat resistance and weatherability of organic resin. ・It imparts flexibility and crack resistance to oligomer type coating agents. |
KR-213 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Methyl / Phenyl type oligomer for resin modificatioon | ・For resin modification ・It imparts flexibility and crack resistance. |
X-40-9312 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | High hardness, flex resistant oligomer | ・It has high hardness and crack resistance. ・Excellent yellowing resistance and crack resistance after light irradiation |
KR-400 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | High | One-component cure high hard oligomer | ・It is a standard product of one-component (containing catalyst) type ・It forms high hard film. |
X-40-2327 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component rapid cure oligomer | ・Rapid cure |
KR-401 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | Medium | One-component cure flex resistant oligomer | ・Excellent flex resistance ・High gloss |
KR-4000G | Silicone Oligomer | Type A | Room Temperature Cure | Organic Solvent | Main Agent | Low | One-component cure high gloss oligomer | ・Excellent gloss ・Excellent water repellency and water sliding property. ・It exhibits antifouling properties even after wiping up applications. |
X-40-2450 | Silicone Oligomer | Type A | Incurable (For Resin Modification) | Solvent-free (100% Silicone Content) | Resin Modifier | – | Ionic liquid modified oligomer | ・Easy to migrate to the surface when added to resin ・It provides antistatic properties with a small amount of addition. ・It has releasability. |
X-40-9300 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main agent, Resin Modifier | Alkary resistant rapid cure oligomer | ・Rapid curing due to extremely high reactivity of alkoxy groups ・Alkali resistance ・Water resistance |
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X-40-9301 | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main agent, Resin Modifier | Alkary resistant oligomer | ・Alkali resistance ・Water resistance |
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KR-517 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups and ethoxy groups. ・Epoxy equivalent 830g/mol |
X-24-9590 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups. ・Epoxy equivalent 590g/mol |
KR-516 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Epoxy group containing oligomer | ・Alkoxy groups are methoxy groups. ・Organic functional groups have methyl groups in addition to epoxy groups. ・Epoxy equivalent 280g/mol |
KR-518 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Mercapto group containing oligomer | ・Alkoxy groups are methoxy groups and ethoxy groups. ・Mercapto equivalent 800g/mol |
KR-519 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Mercapto group containing oligomer | ・Alkoxy groups are methoxy groups. ・Organic functional groups have methyl groups in addition to mercapto groups. ・Mercapto equivalent 450g/mol |
KR-513 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Acrylic group containing oligomer | ・Alkoxy groups are methoxy groups. ・Acrylic equivalent 210g/mol |
X-40-9296 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Methacrylic group containing oligomer | ・Alkoxy groups are methoxy groups. ・Methacrylic equivalent 230g/mol |
KR-511 | Silicone Oligomer | Type AR | Incurable | Solvent-free (100% Silicone Content) | Resin Modifier | – | Vinyl group containing oligomer | ・Alkoxy groups are methoxy groups. ・Vinyl equivalent 530g/mol |
KR-470 | Silicone Oligomer | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | High | Cyclic siloxane tetrafunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・It has a cyclic siloxane back bone and shrinkage is small during curing. |
X-40-2678 | Silicone Oligomer | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Cyclic siloxane bifunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・It has a cyclic siloxane back bone and shrinkage is small during curing. ・Excellent crack resistance due to bifunctionality |
X-40-2669 | Silicone Oligomer | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Linear siloxane bifunctional oligomer containing alicyclic epoxy group | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・With straight-chain siloxane back bone, good leveling property and wettability ・Low viscosity and effective as a reactive diluent |
X-40-2728 | Silicone Oligomer | Type R | Heat Cure, UV cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | Medium | Glycidyl group containing cyclic siloxane bifunctional oligomer | ・Relatively low molecular weight and excellent compatibility with epoxy resins ・ It has a cyclic siloxane back bone and shrinkage is small during curing. ・Excellent crack resistance due to bifunctionality |
X-40-2761 | Silicone Oligomer | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent, Resin Modifier | – | Acrylic group containing flex resistant oligomer | ・It imparts crack resistance. ・Excellent compatibility with acrylates and various photo initiators |
KR-2710 | Silicone Oligomer | Type R | Incurable | Solvent-free | Resin Modifier | – | Polycarbonate flame retardant | ・Polycarbonate flame retardant ・Excellent transparency |
X-48-1800 | Silicone Oligomer | – | Incurable | Solvent-free | Resin Modifier | – | Silicone for cold blend resin modification | ・Cold blend resin modifier for silane modified acrylic resin ・Improving weatherability, heat resistance, magic marker stain resistance and acid and alkali resistance ・Recommended addition amount = 10 to 50 parts per 100 resin solid content |
X-48-1801 | Silicone Oligomer | – | Incurable | Solvent-free | Resin Modifier | – | Silicone for cold blend resin modification | ・Cold blend resin modifier for isocyanate curing resin ・Improving weatherability, magic marker stain resistance ・Recommended additive amount = 3% to 20% (converted to NCO equivalent) to curing agent |
X-48-5030 | Silicone Oligomer | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent | High | Solvent-free UV cure hard coating agent | ・Excellent low viscosity, scratch resistance, and low warpage |
X-48-5031 | Silicone Oligomer | Type R | UV Cure | Solvent-free (100% Silicone Content) | Main Agent | High | Solvent-free UV cure hard coating agent | ・Excellent weatherability, low viscosity, scratch resistance and low warpage. |
X-88-2003A | Silicone Oligomer | Type A | Room Temperature Cure | Solvent-free (100% Silicone Content) | Main Agent | High | High hard, crack resistant, anti-fouling coating agent | ・It has high hardness and crack shrinkage property (Water repellency, water sliding property, magic marker stain resistance) ・One-component rapid cure type |