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Thermal Interface Materials

About silicones Thermal Interface MaterialsApplication examplesProduct lineupReference material

Better cooling for better performance.

The performance of electronic devices is constantly improving, but they consume more power and generate greater heat. If heat can not escape efficiently, the performance of the device suffers. That's why thermal interface materials are becoming such an important technology in the electronics industry. Silicone-based thermal interface materials are compound materials which contain a high ratio of thermally conductive fillers. They exhibit outstanding thermal conductivity because they fit snugly in the gap between the heat-generating unit and the heatsink.

Shin-Etsu Silicone has the solution for heat dissipation. Our diverse lineup of products is designed for a range of applications and performance requirements.

Application examples

  • Heat dissipation for power transistors and power modules
  • Heat dissipation for electronics devices
    (notebook PCs, LED lighting, hybrid cars, electric cars, and others)

Product lineup

Oil Compounds

Thermally conductive oil compounds are grease-like products containing silicone fluids as a base oil, and thermally conductive fillers such as alumina powder. Silicone oil compounds show excellent stability against thermal oxidation, in addition to excellent electrical properties over a wide temperature range.

Main Features
  • Excellent thermal conductivity
  • Grease-like products can be screen printed
  • These products show the following characteristics due to their excellent heat and cold resistance:
  1. High dropping point
  2. Less oil separation and lower volatile matter
  3. Good stability against thermal oxidation
  4. Good stability against consistency changes
  5. No solidification at temperatures under 0°C
Primary Applications
Schematic diagram
Schematic diagram
  • Good performance is obtained when these materials are used for thermal conductivity of semiconductor devices such as power transistors, ICs, and CPUs
  • For thermal conductivity of resin-encapsulated power transistors
  • These materials are best suited for potting between heatsinks and such components as transistors, rectifiers, and thyristors
  • For sealing the measuring parts of thermistors, thermocouples, etc.
  • For potting of heat-generating components in devices such as heaters, and heat dissipaters
General Properties
Grade G-751 X-23-
7762
X-23-
7783D
X-23-
7868
-2D
X-23-
7921-5
G-775 G-776 G-777 G-779

Color and Consistency

Gray Gray Gray Gray Gray White White White White

Viscosity at 25°C

Pa·s
420 180 200 100 360 500 60 140 160

Specific Gravity at 25°C

2.51 2.55 2.55 2.5 2.8 3.4 2.9 3.2 3.2

Thermal
Conductivity*1

W/m·K
4.5 4.0
(6.0*2)
3.5
(5.5*2)
3.6
(6.2*2)
6.0 3.6 1.3*2 3.3 3.0

Thermal
Resistance

mm2·K/W
17
(62µm)
15
(73µm)
8.0
(38µm)
7.0
(25µm)
5.8
(25µm)
25
(75µm)
7.4
(7.8µm)
21
(56µm)
10.6
(25µm)

Breakdown
Strength

kV(0.25mm)
Below measurable limit 2.5 2.9 3.2 3.2

Volatile Content
150°C×24h

%
0.10 2.58 2.43 2.70 0.44 0.26 3.10 0.1 0.18

Usable
Temperature Range

°C
-50 to
+120
-50 to
+120
-50 to
+120
-50 to
+120
-50 to
+120
-40 to
+150
-40 to
+200
-40 to
+200
-40 to
+200

*1 Measured with hot disc method.  *2 After solvent evaporation.

(Not specified values)

High-hardness Thermal Interface Silicone Rubber

The high-hardness TC Series products have excellent insulation. These products are composite products of silicone rubber combined with fillers to enhance heat dissipation. These materials are pliable and adhesive, and are best suited for use as a sealant to heat-generating components and heatsinks. They exhibit superior thermal conductivity.

Main Features
  • These products have fine electrical properties (electric non-conductivity, etc.)
  • There is a reinforcement type with the Fiberglass or Polyimide film.
  • All products are UL-certified for flame-retardancy.
  • Can be used in a wide temperature (-40 °C to +180 °C).
Primary Applications
  • For thermal conductivity and electrical insulation for power transistors and power modules
  • For thermal conductivity, electrical insulation and vibration damping of semiconductor devices such as CPUs and electrical components
  • TC series act as heat dissipaters, electrical insulators and thermal conductivity for thermal fuses and temperature sensors
Structure
Structure
Schematic diagram
Schematic diagram
General Properties
Type High-hardness Thermal Interface Silicone Rubber
Sheet type

Paratemer

Series
TC-TA-1
Series
TC-TAG-2
Series
TC-TAP-2
Series
TC-TAG-3
Series
TC-TAG-8
Series
TC-BG
Series

Color

Deep brown Purple Light purple Dark gray Light gray White

Reinforcement Layer

None Fiberglass Polyimide film Fiberglass Fiberglass Fiberglass

Size

mm
300x1,000 300x1,000
Roll
320x1,000
Roll
300x1,000
Roll
420x500 210x270

Thickness

mm
0.20, 0.30
0.45
0.20, 0.30
0.45, 0.80
0.11 0.20, 0.30
0.45
0.20, 0.30
0.45
0.20, 0.30
0.45
Properties of Representive Products TC-30TA-1
(Thickness: 0.30mm)
TC-
30TAG-2
(Thickness: 0.30mm)
TC-
11TAP-2
(Thickness: 0.11mm)
TC-
30TAG-3
(Thickness: 0.30mm)
TC-
30TAG-8
(Thickness: 0.30mm)
TC-30BG
(Thickness: 0.30mm)

Thermal Conductivity,
Bulk Elastomer

W/m・K
ISO
22007-2*1
1.0 1.8 1.8 3.4 8.0 7.3

Thermal Conductivity
of Products

W/m・K
ISO
22007-2*1
1.1 1.4 0.9 2.1 4.7 4.0

Thermal Resistance
50°C/100psi

cm2・K/W
ASTM D5470 3.8 2.5 2.0 1.7 1.0 1.9

Density at 23°C

g/cm3
JIS K 6249 1.70 1.86 1.65 2.84 1.56 1.66

Hardness Durometer A

JIS K 6249 70 91 87 90 83 91

Dielectric Breakdown
Voltage  Air

kV
JIS K 6249 15 10 8 9 8 15

Dielectric Strength  Air

kV
JIS C 2110 15 7 6 7 7 13

Volume Resistivity

TΩ・m
JIS K 6249 5.4 3.5 14.0 0.9 5.4 68.0

Flame retardance UL94

- V-0 (UL file No. E48923)

Low-Molecular-weight
Siloxane Content
ΣD3-D10

ppm
Shin-Etsu
method*2
40 30 < 10 < 10 20 < 0

*1 Hot disk method
*2 Aceton extraction method

(Not specified values)

* We provide not only sheet, but also Cap or Tube shapes. So if you need them, please contact our sales department.

Thermal Interface Silicone Soft Pads / Ultra Soft Pads

Thermal interface silicone soft pads / ultra soft pads are made of silicone rubber combined with thermally conductive fillers. The line-up are single layer type and composite type. They are soft with good adhesion, so they bonding tightly to the heat-generating unit and the heatsink, providing more efficient cooling.

Main Features
Application of pad
Application of pad
  • These products are capable of close conformity to irregular or complex surfaces.
  • They are easy to apply and remove, and can be used for temporary attachment.
  • All products are UL-certified for flame-retardancy.
  • Excellent cost performance and high thermal conductivity.
  • Can be used in a wide temperature (-40°C to +180°C).
Primary Applications
  • Heat dissipation for MPUs of computers, etc.
  • Heat dissipation for surface packaging microchips which generate high heat.
Structure
Single layer type
Composite type
General Properties
Type Thermal Interface Silicone Soft Pads

Paratemer

Series
TC-HSV-1.4
Series
TC-TXS
Series
TC-TXS2
Series
TC-SP-1.7
Series

Color

Gray Gray Gray Light blue, Gray

Size

mm
300x400 300x400 300x400 300x400

Thickness*1

mm
0.5, 1.0, 1.5
2.0, 2.5, 3.0
4.0, 5.0
0.5, 1.0, 1.5
2.0, 2.5, 3.0
4.0, 5.0
0.5, 1.0, 1.5
2.0, 2.5, 3.0
4.0, 5.0
0.5, 1.0, 1.5
2.0, 2.5, 3.0
4.0, 5.0
Properties of Representive Products TC-HSV-1.4
(Thickness: 1.0mm)
TC-TXS
(Thickness: 1.0mm)
TC-TXS2
(Thickness: 1.0mm)
TC-SP-1.7
(Thickness: 1.0mm)

Thermal Conductivity,
Bulk Elastomer

W/m・K
ISO 22007-2*3 1.2 3.3 3.3 1.5

Thermal Resistance
50°C/40psi

cm2・K/W
ASTM D5470 6.9 2.7 2.2 8.2

Density at 23°C

g/cm3
JIS K 6249 2.5 3.1 3.1 2.3

Hardness Asker C*2

JIS K 6249 25 45 20 2

Dielectric Breakdown
Voltage  in Oil

kV
JIS K 6249 23 20 21 20

Dielectric Strength
in Oil

kV
JIS C 2110 18 18 17 16

Flame retardance UL94

- V-0 (UL file No. E48923)

Low-Molecular-weight
Siloxane Content
ΣD3-D10

ppm
Shin-Etsu
method*4
260 240 600 240

(Not specified values)

*1 About the lineup of other thicknesses please contact our sales department.
*2 Thickness (Asker C): Measured using 2 overlapping thermal interface silicone soft pads (Thickness: 6 mm).
*3 Hot disk method  *4 Aceton extraction method

Type Thermal Interface Silicone Ultra Soft Pads

Paratemer

Series
TC-CAS-10
Series
TC-CAB-10
Series
TC-CAD-10
Series
TC-CAT-20
Series
TC-CAF-40
Series

Color

Dark gray Pink Light reddish-purple Gray Light purple

Size

mm
300x400 300x400 300x400 300x400 300x400

Thickness*1

mm
0.5, 1.0, 1.5
2.0, 2.5, 3.0
4.0, 5.0, 6.0
7.0, 8.0, 9.0
10.0
0.5, 1.0
1.5, 2.0
2.5, 3.0
4.0, 5.0
0.5, 1.0
1.5, 2.0
2.5, 3.0
4.0, 5.0
0.5, 1.0
1.5, 2.0
2.5, 3.0
4.0, 5.0
0.5, 1.0
1.5, 2.0
2.5, 3.0
4.0, 5.0
Properties of Representive Products TC-CAS-10
(Thickness: 1.0mm)
TC-CAB-10
(Thickness: 1.0mm)
TC-CAD-10
(Thickness: 1.0mm)
TC-CAT-20
(Thickness: 1.0mm)
TC-CAF-40
(Thickness: 1.0mm)

Thermal Conductivity,
Bulk Elastomer

W/m・K
ISO 22007-2*3 1.8 2.3 3.2 4.5 5.2

Thermal Resistance
50°C/40psi

cm2・K/W
ASTM D5470 3.3 2.4 2.2 1.6 1.5

Density at 23°C

g/cm3
JIS K 6249 1.9 2.2 3.0 3.2 3.3

Hardness Asker C*2

JIS K 6249 10 10 10 20 40

Dielectric Breakdown
Voltage  in Oil

kV
JIS K 6249 22 22 15 15 16

Dielectric Strength
in Oil

kV
JIS C 2110 10 11 11 11 11

Flame retardance UL94

- V-0 (UL file No. E48923)

Low-Molecular-weight
Siloxane Content
ΣD3-D10

ppm
Shin-Etsu
method*4
240 220 180 260 90

(Not specified values)

*1 About the lineup of other thicknesses please contact our sales department.
*2 Thickness (Asker C): Measured using 2 overlapping thermal interface silicone ultla soft pads (Thickness: 6 mm).
*3 Hot disk method  *4 Aceton extraction method

Thermal Interface Phase Change Materials

Thermal Interface Phase Change Materials are thermally conductive sheets which undergo phase-change and soften when exposed to heat. The following performance parameters have been improved.

Main Features
Application of PC heatsinks
Application of PC heatsinks
  • After phase-change, the PCM conforms tightly to uneven surfaces.
  • Silicone based PCM are highly resistant to pump-out.
  • Easy transfer for high process efficiency.
Primary Applications
  • Heat transfer medium for use with heat-generating devices such as PCs, DVD drives, power supply units, etc.
  • Heat dissipation for heat-generating electronic components.
A single sheet can fill in gaps both narrow and wide.
Improving close contact reduces thermal resistance.
General Properties
Grade PCS-CR-10 PCS-PL-30

Color

- White White

Initial Thickness

µm
- 200 120

Bond Line Thickness*1

µm
Micro gauge 10 30

Reinforcement Layer

- None Polyimide film

Density at 23°C

g/cm3
JIS K 6249 2.9 2.7

Dielectric Breakdown
Voltage  Air

kV
JIS K 6249 - 5.5*3

Softening Point

°C
Shin-Etsu method Approx.50 Approx.50

Thermal Conductivity

W/m·K
ASTM E1461*2 2.0 1.7*4

Thermal Resistance*1

cm2·K/W
ASTM E1461*2 0.08 0.73

Size

mm
- 300x400, Roll 320x400, Roll

Flame Retardance UL94

- V-0 equivalent V-0 equivalent

*1 After 1 hour compression, 50 psi / 100°C
*2 Laser flash method.
*3 Measured by initial thickness.
*4 Thermal conductivity of PCM.

(Not specified values)

Double Sided Thermal Interface Silicone Tapes

Thermal interface tape: Single layer, double-sided adhesive. New lineup will include 100 µm and 200 µm thicknesses.

Main Features
  • Strong and stable adhesive strength without screws.
  • Thermal resistance is stable across a wide temperature range.
  • Can be applied to wide areas using automated equipment.
Primary Applications
  • Heat dissipation for power transistors
  • Heat dissipation for substrates
Reliability test data
Reliability test data
General Properties
Grade TC-10SAS TC-20SAS

Color

- White White

Size

mm
- 300x400 300x400

Matrix

- Silicone Silicone

Thickness*1

µm
- 100 200

Dielectric Breakdown Voltage  Air

kV
JIS K 6249 3 6

Thermal Conductivity

W/m·K
ASTM E1461*3 1.0 1.0

Thermal Resistance

cm2·K/W
ASTM E1461*3 2.0 2.9

Peeling Strength*2

Aluminum

- 6.0 6.4

SUS

- 7.0 7.6

Glass epoxy

- 7.6 8.1

Flammability UL94

- V-0(UL file No. E48923)

(Not specified values)

*1 About the lineup of other thicknesses please contact our sales department.
*2 After sticking a tape on a test plate, then pressed down using a 2 kg roller.
After 10 minutes, the tape was then peeled off in the 180-degree direction and measurements taken.
(Temp.: 23°C, peeling speed: 300 mm / min)
*3 Laser flash method

Condensation-cure Type RTV Silicone Rubber

Shin-Etsu condensation curing silicone rubbers are one component type adhesives compounded with a special filler to enhance thermal conductivity. These materials are in liquid or paste form before curing. When exposed to the air, they start to cure while generating a small amount of cure by-product.

Main Features
  • Excellent thermal conductivity a Easy to handle.
  • Excellent adhesion a Superior electrical properties.
  • These materials exhibit outstanding heat and cold resistance, and show stable properties in a wide temperature range from -40°C to 180°C.
Primary Applications
Application of RTV rubber
Application of RTV rubber
  • For sealing and thermal conductivity of electrical and electronic components
  • For sealing of thermocouples
  • Heat-dissipation for optical pickup diodes aFor sealing of heat exchangers
  • Better performance can be obtained when these materials are used as a heat bonding material for the joints
General Properties
Type One-component adhesive type, Condensaton cure
Grade KE-4961-W KE-4962-W G-1000 X-23-8064-1

Cure Type (by-product gas)

Condensation
(Alcohol)
Condensation
(Alcohol)
Condensation
(Acetone)
Condensation
(Acetone)

Appearance

White White White White

Viscosity at 23°C

Pa·s
- - 80 130

Density at 23°C

g/cm3
2.34 2.65 3.04 3.00

Hardness Durometer A

80 88 40 (Asker C) 45

Tensile Strength

MPa
3.9 4.4 - -

Elongation at break

%
60 30 - -

Volume Resistivity

TΩ·m
1.0 1.0 - -

Thermal Conductivity*

W/m·K
1.6 2.4 2.4 3.2

Dielectric Constant 50Hz

4.3 4.4 - -

Dielectric Dissipation Factor 50Hz

1×10-1 - - -

Dielectric
Breakdown Strength

kV/mm
24 25 14 16

Tack Free Time

min
1 2 3 3

Lap Shear Strength (Al/Al)

MPa
0.7 0.8 - -

Flammability UL94

V-0 V-0 equivalent - -

Low-Molecular-weight
Siloxane Content ΣD3-D10

ppm
< 300 < 300 < 100 < 100

Curing conditions: 23°C±2°C, 50±5% RH × 7days
* Measured with hot-wire method.

(Not specified values)

Addition-cure Type RTV Silicone Rubber

Shin-Etsu silicone rubber products, compounded with special filler to enhance the properties of thermal conductivity, are heat curable addition cure type and can thus be uniformly cured in a short period of time regardless of the thickness of the rubber.

Main Features
  • Excellent thermal conductivity a Excellent electrical properties.
  • Superior heat and cold resistance a Deep section curing is possible.
  • Excellent resistance to chemicals and medicine a Superior flame retardant properties.
Primary Applications
Application of RTV rubber
Application of RTV rubber
  • As sealant for heatsinks and pipes
  • As sealing materials for thermal conductive circuits
  • As protection and thermally conductive potting materials for electrical and electronic components
  • As molding materials for thermally conductive parts and components
General Properties
Type One-component adhesive type,
Addition cure
Two-component adhesive type,
Addition cure
Grade KE-1867 KE-1869 KE-1891 KE-1897-A/B KR-1898-A/B

Appearance

Gray Light gray Light gray A: Gray /
B: White
A: Gray /
B: White

Viscosity at 23°C

Pa·s
70 30 Paste A: 17 / B: 7 A : 22 / B : 14

Density at 23°C

g/cm3
2.92 2.52 3.06 2.61 2.86

Hardness

Durometer A

75 - 96 20 22

Penetration

- 30 - - -

Tensile Strength

MPa
2.1 NA 5.3 0.4 0.4

Elongation at break

%
60 NA 10 100 60

Volume Resistivity

TΩ·m
1.2 3.0 3.4 0.2 6.0

Thermal Conductivity*

W/m·K
2.2 1.1 4.0 1.6 2.2

Dielectric Constant 50Hz

6.7 5.3 - 6.0 -

Dielectric Dissipation Factor 50Hz

4.5×10-3 2×10-3 - 0.6×10-2 -

Dielectric
Breakdown Strength

kV/mm
23 24 25 25 19

Standard Curing Condition

120°C×1h 120°C×1h 120°C×1h 120°C×1h 120°C×1h

Lap Shear Strength
(Al/Al)

MPa
0.8 - 0.8 0.3 0.3

Flammability UL94

V-0 - V-0 V-0 V-0

Blend Ratio

NA NA NA 100 : 100 100 : 100

Low-Molecular-weight
Siloxane Content ΣD3-D10

ppm
< 300 - < 300 < 500 < 500

* Measured with hot-wire method.

(Not specified values)
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