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Thermal Interface Silicone Ultra Soft Pad
TC-CA Series
The newly developed series of products have both high thermal conductivity and excellent electrical insulation properties, which stem from Shin-Etsu's advanced polymer and thermally conductive filler composite material technologies.
Features
- High cost performance
- High thermal conductivity
- Low-hardness that makes for good compressibility and a stress-relaxation property that can reduce stress to heat modules
- Excellent workability and processibility
- Low specific gravity
Applications
The main application of this new series of silicone soft pad products will be for countermeasures against the heat emanating from various electronics devices,
- notebook PCs
- LED lighting
- hybrid cars and electric cars etc.
It meets demands for thinner and lighter weight device applications.
General Properties
| Parameter | TC-CAS-10 | TC-CAB-10 | TC-CAD-10 | TC-CAT-20 | |
|---|---|---|---|---|---|
Appearance |
Dark gray | Pink | Light reddish purple |
Gray | |
Structure |
Single layer | Single layer | Single layer | Single layer | |
Density g/cm3 |
1.9 | 2.2 | 3.0 | 3.2 | |
Hardness |
Asker C | 10 | 10 | 10 | 20 |
| Shore00 | 25 | 25 | 25 | 45 | |
Dielectric Breakdown Voltage 1mm kV |
22 | 22 | 15 | 15 | |
Thermal Conductivity*1 W/m・K |
1.8 | 2.3 | 3.2 | 4.5 | |
Thermal Resistance*2 °C/W |
0.65 | 0.49 | 0.43 | 0.32 | |
Flame Retardancy UL94UL94 |
V-0 | V-0 | V-0 | V-0 | |
Thickness mm |
0.5 - 10.0 | 0.5 - 5.0 | 0.5 - 5.0 | 0.5 - 5.0 | |
Operating temp. range °C |
-40 - 150 | -40 - 150 | -40 - 180 | -40 - 180 | |
*1 Based on ISO-22007-2
*2 Based on Shin-Etsu method (Thickness: 1 mm)
