The SR-BOND series consists of thermally conductive adhesive tape in a wide range temperatures.

• Thermal Resistance

*Measured by laser flash method
(Not specified values)

Features

• Good adhesion in a wide range of temperatures (-40°C to +180°C)
• Easy to use. Can be increased adhesive strength by heating
• Low thermal resistance
• Excellent long-term reliability
• Can be stored at room temperature

Applications

• LED, transistor for power supply, etc.

General Properties

Parameter Product name	SR-BOND-1-100	SR-BOND-1-200
Appearance	White
Thickness µm	100	200
Thermal conductivity*1 W/m·K	1.2
Specific gravity	1.9
Dielectric breakdown strength  Air kV	6	9
Dielectric strength  Air kV	4	7
Thermal resistance cm2·K/W	1.55	2.40
Tackiness*2 gf	220	230
Lap shear strength (Al/Al)*3 MPa	2.7	2.4

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