KE-1066-A/B
This is suitable for encapsulation of power semiconductors that efficiently convert energy and operate at high temperatures, and is used in transportation equipment such as electric vehicles and railways, or in industrial equipment.
Parameter Product name | KE-1066-A/B | |
---|---|---|
Good point |
High heat and cold resistance, Good Adhesion | |
Appearance |
Color | A: Pale brown / B: Colorless |
Transparency | A: Transparent / B: slightly cloudy | |
Viscosity at 23°C mPa·s |
A: 950 / B: 500 | |
Blend ratio |
100 : 100 | |
Specific gravity at 25°C |
A/B: 0.99 | |
Electrical conductivity water extraction mS/m |
A/B: 0.2 | |
Standard curing condition |
80°C×1 h | |
Gel time at 80°C min |
2 | |
Penetration |
30 | |
Penetration After 200°C×2,000 h |
29 | |
Volume resistivity TΩ·m |
15 | |
Adhesion MPa |
Al | 0.4 |
Cu | 0.4 | |
Dielectric breakdown strength at 23°C kV/mm |
16 |