Two-component liquid silicone rubber compounds cure by adding a specified amount of a curing agent to the base compound. Like one-component liquid silicone rubbers, two-component liquid silicone rubbers have outstanding electrical properties and resistance to heat and cold, while also offering improved deep-section curability and storage stability.
Electrical properties, heat and cold resistance, impact resistance, weatherability, curing characteristics, etc.
The curing reaction proceeds uniformly at the surface and internally, regardless of rubber thickness.
Cure time can be adjusted by changing the type or quantity of curing agent, or by heating.
The base compound and curing agent are stored separately, so the product will not become unusable due to curing during storage. Two-component liquid silicone rubbers can be stored for long periods.
Applications | Intended use |
Grade | Curing method |
Reaction mechanism (By-product gas) |
Features |
---|---|---|---|---|---|
General electrical applications | Sealing, fixing | KE-270-A/B | Room temperature cure | Condensation (Alcohol) |
No cure inhibition, Initial adhesion expression within 2h*. |
KE-1189-A/B | Room temperature cure | Addition | Cure time shortened by heating, Initial adhesion expression within 2h*. | ||
Potting | KE-260 | Room temperature cure | Condensation (Alcohol) |
Self adhesion | |
KE-103 | Room temperature cure | Addition | Transparent | ||
KE-106 | Heat cure | Addition | Transparent | ||
KE-108 | Room temperature cure | Condensation (Alcohol) |
Transparent | ||
KE-109E-A/B | Heat cure | Addition | Transparent, adhesion | ||
KE-1051J-A/B | Heat cure | Addition | Transparent gel | ||
KE-1283-A/B | Heat cure | Addition | For LED and display applications | ||
Flame-resistance | Potting | KE-1292-A/B | Heat cure | Addition | UL certified product, multipurpose use |
KE-1280-A/B | Heat cure | Addition | UL certified product, low specific gravity | ||
Thermal interface materials | Potting | KE-1897S-A/B | Heat cure | Addition | UL certified product, thermal conductivity 2.1W/m・K |
Precision parts | Potting | FE-78-A/B | Heat cure | Addition | Oil and solvent resistance (Fluoro silicone gel) |
KER-2500-A/B | Heat cure | Addition | LED encapsulant | ||
SCR-1016-A/B | Heat cure | Addition | LED encapsulant, Sulfurization prevention |
*Adhesion rate varies with the substrate. It does not guarantee adhesion within 2 hours.